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Please use this identifier to cite or link to this item: http://hdl.handle.net/10087/5790

Title: 高密度実装基板におけるフリップチップリワーク法
Other Titles: Development of Flip Chip Rework Method for High Dense Printed Circuit Board
Authors: 森, 史成
鳥山, 和重
勝, 直樹
荘司, 郁夫
Keywords: Flip Chip
Paste Printing
Reflow Soldering
Issue Date: 1-Jul-2000
Publisher: エレクトロニクス実装学会
Abstract: Flip chip attach technology has many advantages and is considered one of the most important technology in the micro joining field. However, the flip chip rework is difficult when the flip chip bonding is formed on the high density card. We developed new flip chip rework method using the solder capped chip technology. In this technology, Sn-37Pb solder, which is neccessary to form the flip chip joint again, is applied on Pb-3Sn bumps of bare chip by the paste printing method. That solder capped chip was used as the replacement chip on the rework process. This report describes the development of flip chip rework method by solder capped chip.
URI: http://hdl.handle.net/10087/5790
ISSN: 13439677
Appears in Collections:学術雑誌論文

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